The new PC2-6400 CrossFire Certified modules are tested
and qualified under ATI's renowned certification program. This new memory
ensures that gamers get the highest quality and compatibility possible
for their CrossFire system.
The award-winning PC2-6400 gaming solutions from OCZ now feature the
first ever exclusively designed heatspreaders for ATI Technologies.
These modules are cooled with an exclusive ATI special XTC (Xtreme Thermal
Convection) heatspreader displaying ATI's "Certified" logo.
The Reaper (Cas 4) 4GB kit is designed to offer consumers
a high end, high density kit, that is optimized for gamers who require
both faster and more memory to power through the latest graphics intensive
applications and games. The Reaper makes use of the HPC heatspreader,
an innovative patent-pending cooling solution developed by OCZ to effectively
minimize heat produced by high-speed memory. As heat rises into the
thermo-conductive copper heat pipe conduit, it is dissipated through
the strategically-placed compact aluminum fin array.
The Dominator Series Twin2X2048-8500C5D is a 2048 MByte
matched pair of DDR2 SDRAM DIMMs built using Corsair’s latest
high performance heat sink with Dual-Path Heat Xchange (DHX) technology.
This part delivers outstanding performance in the latest generation
of dual-channel DDR2-based motherboards. It has been tested extensively
in multiple DDR2 motherboards to ensure compatibility and performance
at its rated speed. This memory has been verified to operate at 1066MHz
at latencies of 5-5-5-15. Performance of these modules incorporating
DHX can be further enhanced by using the optional Dominator Airflow
Fan, for even more cooling and protection.
The Dominator Series Twin2X4096-8500C5D is 4096MBytes
of DDR2 SDRAM DIMMs built using Corsair’s latest high performance
heat sink with Dual-Path Heat Xchange (DHX) technology. This memory
has been verified to operate at 1066MHz at latencies of 5-5-5-15-2T
at 2.1VDIMM. The Twin2X4096-8500C5D comes with Enhanced Performance
Profiles (EPP), the open standard for performance module SPD’s
jointly developed by Corsair and NVIDIA. EPP SPD’s on Corsair
modules allow users to automatically configure EPP enabled motherboards
with aggressive memory performance settings, for maximum memory and
system performance.
The latest PC titles that make use of DirectX 10 crave
more than the standard 2GB of RAM for the ultimate gameplay experience
and the highest settings. Computer enthusiasts and professionals utilizing
high-bandwidth video, music, and graphics applications will also benefit
from the ultimate balance of speed and density the new PC2-8500 4GB
Reaper HPC offers.
The TW3X2G1600C9DHX G is a 2048MByte matched pair of
DDR3 SDRAM DIMMs built using Corsair’s latest high performance
heat sink with Dual-Path Heat Xchange (DHX) technology. This part delivers
outstanding performance in the latest generation of dual-channel DDR3-based
motherboards. It has been tested extensively in popular DDR3 motherboards
to ensure compatibility and performance at its rated speed. This memory
has been verified to operate at 1600MHz at the low latencies of 9-9-9-24.
The TWIN3X4096-1600C7DHXIN G is a
4096MByte kit of DDR3 SDRAM DIMMs based upon Corsair’s high performance
XMS3 DHX family of memory which includes Intel’s Extreme Memory
Proles (XMP). XMP is a JEDEC based performance specication for DDR3
memory SPD optimizations developed by Intel and its performance memory
module partners. This enables a robust, prole based high performance
DDR3 over-clocking solution for Intel platforms targeted for enthusiasts,
gamers and overclockers who want to extract maximum performance from
their platforms. Built using Corsair’s Dual-path Heat Xchange
(DHX) technology, this part delivers outstanding performance with the
Intel’s Extreme Series of DDR3-based motherboards and has been
tested extensively to ensure compatibility and performance at its rated
speed. This memory has been veried to operate at 1600MHz at latencies
of 7-7-7-20 at 1.9V VDIMM.
Project X represents the most advanced
DDR3 memory available. It is developed and built in Super Talent’s
Silicon Valley Engineering Labs to deliver the highest attainable DDR3
memory performance. Project X memory combines blistering fast clock
speeds with aggressively tuned latencies.
Project X employs an extreme cooling solution that offers double the
surface area and 106% more aluminum mass than standard heat spreaders.
With Super Talent’s special thermal adhesive, this cooling solution
provides superior heat dissipation that results in a cooler, faster
memory device.